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3M DP110 Translucent is a two-part
Rigid Bonds: Cures to a rigid state for high static load holding
It contains 24 mixing elements with a 6mm element diameter
PSI 445 ASTM D-1344-78
000 cps 2700/4200 -65 to+200° F <7
ASI MP 5404FS Rapid Heat Cure One Part Epoxy Choose Size:12 Ounce Cartridge 3M DP110 Translucent is aAbout the ASI MP 5404FS Fast Setting Heat Cure Epoxy The Adhesive Systems Inc (ASI) MP5404FS is a single component heat cure epoxy. What makes the MP5404FS unique is that it will cure in under 20 seconds when exposed to heat via an induction or infrared oven. This fast setting epoxy adhesive will bond most substrates including difficult surfaces like ceramic, metal and glass. The MP5404FS is a non sag epoxy and will hold up to water, humidity and most
